Equipment and consumables for Printed Circuit Boards

Mechatronic Systems P20 Pick & Place system

Precision automatic Pick & Place for prototype to low volume SMT assembly.

1 head, smart feeders, 33 feeder positions, 40 manual tape feeders for short strips, up to 1.600 components per hour, bottom camera, 0201 to BGA placing, automatic nozzle exchange, extremely easy to use and intuitive software for development engineers(no need for trained operator), XYZ encoder for precise positioning, optional conveyor, optional dispensing head, built in Windows 10 PC, very good price/performance ratio.

Specifications:

Max. working area 540 x 480 mm (manual feeders and trays reduce working area), 6-8 bar - 20l/min compressor required, power supply 230VAC/ 50 Hz, 1200W, dimensions 840 x 630 x 430 mm, 95 kg

Mechatronic Systems D10 dispensing system

Precision automatic dispensing system for prototype to low volume dispensing.

1 head, time/pressure dispenser (auger, jet and second head optional), up to 8.000 dots per hour, dispensing of solder paste and liquids, contacless distanced dispensing, extremely easy to use and intuitive software for development engineers(no need for trained operator), XYZ encoder for precise positioning, contours and lines optional, optional conveyor, built in Windows 10 PC, very good price/performance ratio.

Specifications:

Max. dispensing area 400 x 500 mm (manual feeders and pallets reduce working area), 6-8 bar - 16l/min compressor required, power supply 230VAC/ 50 Hz, 1200W, dimensions 800 x 700 x 350 mm, 85 kg

Mechatronic Systems S10 SMT stencil printer

Manual SMT stencil printer for frameless stencils.

Vertical separation, fine pitch, pneumatic movement, 4 sided stencil tensioning, X, Y and rotation micro adjustment, manually guided squeegee, motorized squeegee, motorized XYZ and vision camera options available.

Specifications:

Max. printing area 400 x 360 mm, dimensions 860 x 650 x 280 mm, 55 kg, 6-8 bar, 15 l/min compressor required

Mechatronic Systems RK360 reflow oven

Convection / infrared relfow oven for prototype and low volume production.

max. PCB size 360 x 360 mm, max. temperature 300°C, intelligent heating control with multiple heater groups and sensors, user adjustable heating profile which will the oven precisely follow, integrated cooling to prevent moving of PCB and components after reflow, PC programming of profiles and profile recording, ethernet and USB connection, additional user positionable thermocouple, even temperature distribution to prevent cold spots, bigger and smaller working area versions available.

Specifications:

power supply 230VAC 50Hz, 3500 W, dimensions 675 x 630 x 300 mm, 55 kg